Hammond RP1090 105x75x55mm IP65 Polycarbonate Enclosure, Opaque Lid

The RP1090 is a polycarbonate water-tight enclosure with an opaque lid, part of the RP Series. It is the 55 mm deep version of the 105 x 75 mm footprint, for boards carrying taller components, and it gives OEM engineers, integrators and electronics builders a sealed housing for printed circuit boards or components with a higher flame rating than the ABS equivalent.

Its polycarbonate body is rated UL94 V-2, compared with UL94 HB for the ABS version (RP1095). The two piece tongue & groove lid seals on a rubber gasket that is field installed, the enclosure is designed to meet IP65 against oil, dust and water, and the lid has a smooth recessed area for a membrane, label or silkscreen.

Nominal size is 4.13 in x 2.95 in x 2.17 in (105 x 75 x 55 mm). Inside, the drawing gives 49.30 mm [1.94 in] of height and 67.40 mm [2.65 in] of width, and the 55 mm depth adds 15 mm over the 40 mm deep model on the same footprint. PC board mounting posts accept M3 self-tapping screws and take a board up to 92 mm long and 62 mm wide.

The lid is secured with M3.5-0.6 x 10mm self-captivating screws threaded into corrosion resistant bushings for repeated assembly and disassembly; recommended torque is 43-50 ozf.in (30-35 cN.m). Each RP1090 ships in a bag with the box, lid, string gasket, 4 PCB screws and 4 lid screws. Optional inner panels are STC109 (ABS, 3mm) and STA109 (metal, 1mm), and RP108GASKET is the replacement EPDM gasket 2-pack. The part is RoHS and REACH compliant.